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Global Supplier of Environmental Protection

And Safety New Material Solutions

Specific Electronic Resin

In the field of electronic resins, we’re committed to providing high-performance resin and endeavor to offer whole solutions for the field of CCL. Aimed to realize localization of electronic resin for display and IC, we built 110,000 tons of special epoxy resin workshop, supplying benzene and oxazine resin, electronic series of epoxy resin, phenolic resin, series of hydrocarbon resin, and active ester curing agent, special monomer and maleic imide resin series.


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Benzoxazines Resin
Low-DK Benzoxazine Resin series
Modified hydrocarbon resin series
Hydrocarbon resin composition series
Active Ester
Special Resin Monomer
Maleimide Resin series
Benzoxazines Resin

Our company is the first company to realize the mass industrial production of Benzoxazine Resin in China, and is in the leading position in the production, application and research fields of Benzoxazine Resin. Benzoxazine Resin products of our company have passed SGS detection, and they do not contain halogen and RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) harmful substances. The characteristic is that there is no small molecule released during the curing process and the volume is almost zero shrinkage; The curing products have the characteristics of low water absorption, low surface energy, good UV resistance, excellent heat resistance, high residual carbon, no need of strong acid catalysis and open-loop curing.lt is widely used in electronic copper clad laminates, laminates, composite materials, aerospace materials, friction materials and other fields.

Name

Grade No

Appearance

 softening

point

(°C)

Free

Phenol

(%)

GT (s @210℃)

Viscosity

 N.V.

(%)

properties

MDA type Benzoxazine

DFE125

Brownish red transparent liquid

-

≤ 5

100-230

30-70 (s,4# 杯)

70±3

High Tg, high heat resistance, halogen-free flame retardant, high strength and toughness

BPA type Benzoxazine

DFE127

Yellow transparent liquid

-

≤ 5

1100-1600

200-800

Mpa·s

80 土 2

High modulus, high heat resistance, halogen-free flame retardant, low water absorption

BPA type Benzoxazine

DFE127A

Yellow solid

60-85

≤ 5

500-800

-

98±1,5

High modulus, high heat resistance, halogen-free flame retardant, low water absorption

BPF type Benzoxazine

DFE128

Brownish red transparent liquid

-

≤ 5

350-400

30-100

(s,4# 杯)

75±2

Good toughness, high heat resistance, halogen-free flame retardant, low water absorption and low viscosity

ODA type Benzoxazine

DFE129

Brownish red transparent

-

≤ 2

120-500

<2000

mpa.s

65 土 3

Tg: 212°C, Free PlienoK≤ 2%,

Dk: 2.92, Df 0.0051

Low-DK Benzoxazine Resin series

Low dielectric Benzoxazine Resin is a kind of Benzoxazine Resin developed for high frequency and high speed copper clad laminate. This kind of resin has the characteristics of low Dk / DF and high heat resistance. It is widely used in M2, M4 grade copper clad laminate or HDI board, multilayer board, composite materials, friction materials, aerospace materials and other fields.

Name

Grade No

Appearance

softening

point

rc>

Free

Phenol

(%)

GT (s @210℃)

Viscosity

N.V. (%)

properties

Low dielectric benzoxazine

DFE130

 Yellow granular or massive solid

55-80

≤ 5

400-600

≥98.5

Dk: 2.75、Tg:196℃:

 Rapid curing of benzoxazine at medium and low temperature

DFE146

 Brownish yellow transparent liquid

-

≤ 5

100-130

<200 (s,4# 杯)

75±2

Dk: 3.04, Df: 0.0039 High curing speed, high Tg and low dielectric

Benzoxazine with double bond

DFE148

 Brownish red transparent liquid

-

≤ 5

 Actual

measurement

<2000

Mpa·s

80±2

It can react with other resins containing double bond

Main chain benzoxazine

DFE149

 Brownish yellow transparent liquid

-

≤ 3

80-160

<2000

Mpa·s

70 土 2

Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df 0.0074 (10GHz)

DCPD type Benzoxazine

DFE150

Reddish brown transparent liquid

-

≤ 3

2000-2500

<1000

Mpa·s

75±2

Dk: 2.85, Df: 0.0073 (10GHz)

Bisphenol benzoxazine

DFE153

Brownish yellow transparent liquid

≤ 3

100-200

<2000

Mpa·s

70±2

Dk: 2.88, Df: 0.0076 (10GHz) ,

Modified hydrocarbon resin series

Hydrocarbon resin series is an important kind of high frequency circuit substrate resin in 5g field. Because of its special chemical structure, it generally has low dielectric, excellent heat resistance and chemical stability. It is mainly used in 5g copper clad laminates, laminates, flame retardant materials, high temperature resistant insulating paint, adhesives and casting materials. The products include modified hydrocarbon resin and hydrocarbon resin composition.

Modified hydrocarbon resin is a kind of hydrocarbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.

Name

 Grade

No

 Appearance

 N.V.

(%)

 Viscosity

(mPa.s)

properties

Modified styrene butadiene resin

DFE401

Light yellow liquid

35±2.0

<3000

 High molecular weight and low dielectric. Mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Epoxy resin modified styrene butadiene resin

DFE402

Colorless to yellowish liquid

60±2.0

<5000

 Anhydride modified epoxy with low dielectric properties is

mainly used in high-speed materials

Styrene butadiene resin with low dielectric properties

DFE403

60±2.0

<2000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Modified hydrocarbon resin

DFE404

40+2.0

<2000

 Low dielectric, low water absorption, high peel strength

Modified polystyrene resin

DFE405

60 土 2.0

<3000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Modified hydrocarbon resin

DFE406

35±2.0

<2000

Low water absorption, high peel strength, better dielectric

properties

hydrocarbon resin

DFE412

Light yellow liquid

50 土 2.0

<8000

 High modulus, high molecular weight and low dielectric

Double bond resin with low dielectric properties

DFE416

 Colorless to yellowish liquid

60+2.0

<2000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Hydrocarbon resin composition series

Hydrocarbon resin composite is a kind of hydrocarbon resin composite developed by our company for 5g communication. After dipping, drying, laminating and pressing, the composite has excellent dielectric properties, high peel strength, good heat resistance and good flame retardancy. It is widely used in 5g base station, antenna, power amplifier, radar and other high- frequency materials.carbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.

Name

 Grade No

 Appearance

 N.V.

(%)

properties

Hydrocarbon resin composition

DFE407

White to yellowish liquid

65 ±2.0

Dk/Df: 3.48/0.0037   Mainly used in power amplifier (V0)

DFE407A

65 ±2.0

Dk: 3.52

High fluidity, mainly used in the production of adhesive

sheet

DFE408

65 ±2.0

Dk/Df: 3.00/0.0027

Mainly used in base station and antenna (multilayer board, flame retardant V0)

DFE408A

65 ±2.0

Dk: 3.00

High fluidity, mainly used in the production of adhesive

sheet

DFE409

65 ±2.0

Dk/Df: 3.30/0.0027

Mainly used in antenna (double-sided board, non flame retardant V0)

DFE410

65 ±2.0

Dk/Df: 3.40/0.0029

Mainly used in antenna (double-sided board, non flame retardant V0)

DFE411

65 土 2.0

Dk/Df: 3.38/0.0027

Mainly used in power amplifier (non flame retardant)

Active Ester

he active ester curing agent reacts with epoxy resin to form a grid without secondary alcohol hydroxyl group. The curing system has the characteristics of low water absorption and low Dk / Df.

Name

Grade No

appearance

Ester equivalent

N.V.

(%)

Viscosity (卬s)

softening point

rc)

Low dielectric active ester curing agent

DFE607

Light brown viscous liquid

230〜240

69 ±1.0

1400〜1800

140〜150

DFE608

Brownish red liquid

275-290

69±1.0 Available solids

800-1200

140-150

DFE609

Brown liquid

275-290

130-140

DFE610

Brown liquid

275-290

100-110

Special Resin Monomer

The content of phosphorus is more than 13%, the content of nitrogen is more than 6%, and the hydrolysis resistance is excellent. It is suitable for electronic copper clad laminate, capacitor packaging and other fields.

BIS-DOPO ethane is a kind of phosphate organic compounds, halogen-free environmental flame retardant. The product is white powder solid. The product has very good thermal stability and chemical stability, and the thermal decomposition temperature is above 400 °C. This product is highly efficient flame retardant and environmentally friendly. It can fully meet the environmental requirements of the European Union. It can ~be used as a flame retardant in the field of copper clad laminate. In addition, the product has excellent compatibility with polyester and nylon, so it has excellent spinnability in the spinning process, good continuous spinning and coloring properties, and is also widely used in the field of polyester and nylon.

Name

Grade

No

Appearance

melting

point

(℃)

P%

%

N%

(%)

Td5%(℃)

Properties

Phosphazene flame retardant

DFE790

Earthy white or yellow powder

108 ±4.0

≥13

≥6

≥320

High phosphoms content, flame retardant, high heat resistance, hydrolysis resistance, suitable for copper clad laminate and other fields

Name

Grade

No

Appearance

content

%

melting

point

CC)

P%

%

Td2%

V

Properties

BIS-DOPO ethane

DFE791

White powder

≥99

290-295

≥13

≥400

Chloride ion content < 20ppm, high melting point, high cracking tenperature, low e^ansion coefficient

Maleimide Resin series

DFE930n DFE936> DFE937, DFE939^ DFE950 and DFE952 are all electronic grade maleimide resins with high purity, less impurities and good solubility. Due to the imine ring structure in the molecule, they have strong rigidity and excellent heat resistance. They are widely used in aerospace structural materials,carbon fiber high temperature resistant structural parts,high temperature resistant impregnating paint, laminates, copper clad laminates, molded plastics, etc High grade printed circuit "board, wear-resistant materials, diamond wheel adhesive, magnetic materials, casting parts and other iunctional materials and other high-tech fields.

Name

Grade NO

Appearance

Melting

point

(℃)

Acid Value ( mg KOH/g)

Volatile

content

(%)

(5mm) Solubility of hot toluene (5min)

Properties

Electrical grade Bismaleimide

DFE928

Yellow solid particles

158±2

≤3.0

≤0.3

Fully soluble

 High heat resistance

Electronic grade diphenylmethane Bismaleimide

DFE929

Light yellow solid particles

162 ±2

≤1.0

≤0.3

 High purity and low acid value

Electronic grade Bismaleimide

DFE930

Light yellow white powder

160 ±2

≤1.0

≤0.3

High purity aad low acid^lue

Low crystalline Bismaleimide

DFE936

168 ±2

≤1.0

≤0.3

Good solubility

 Low crystalline and low dielectric Bismaleimide

DFE937

168 ±2

≤1.0

≤0.3

Good solubility

Phenyl bismaleimide with low melting point

DFE939

 Light brown solid or yellow solid powder

50 土 10

≤3.0

≤0.3

Good solubility

Low melting point polymaleimide

DFE950

50 ±10

≤3.0

≤0.3

Good solubility

Low meltmg point tetramaleirnide

DFE952

50 ±10

≤3.0

≤0.3

Good solubility

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