Standard Epoxy Resin
Bisphenol A epoxy resin
Bisphenol F epoxy resin
Bisphenol A epoxy resin
| Epoxy Resin Technical Specifications | Packaging Method | Application | |||||||||||||
| Model | Color | Form | Solid Content (%) |
EEW (g/eq) |
Softening Point (℃) |
Chromaticity (G/H) |
Viscosity (mPa·s) |
Hydrolyzable Chlorine (ppm) |
Bromine Content (%) |
Phosphorus Content (%) |
Sample | ||||
| Bisphenol A Epoxy Resin | － | EMTE126 | Colorless to Light Yellow | Liquid | － | 170-190 | － | H≤15 | 4500-5500 | ＜50 | － | － | － | Iron drum:240kg/drum IBC package: 1000kg ISO tank package:22tons | Solvent-free coatings, adhesives, FRP, carbon fiber composites. |
| EMTE 128Series |
EMTE127 | Colorless | 180-190 | G≤1 | 8000-11000 | ＜500 | － | Coatings, electronic materials, composite materials, adhesives, epoxy flooring and other fields. | |||||||
| EMTE128 | 184-190 | G≤0.1 | 11000-15000 | ＜500 |  |
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| EMTE128H | 184-194 | G≤1 | 12000-15000 | ＜100 | － | ||||||||||
| － | EMTE134 (E44) |
Colorless to Light Yellow |
210-240 | H≤100 | － | ≤1500 |  |
Iron drum: 220kg/drum. | Bonding various materials, such as metals, ceramics, plastics and composite materials and metal surfaces to prevent corrosion and erosion of corrosive media, etc. | ||||||
| EMTE 901A80 |
Colorless | 80±1.0 | 450-500 | G≤0.2 | 3000-7000 | － |  |
IBC package: 1000Kg | Heavy anti-corrosion coatings, composite materials, insulation materials and other fields. | ||||||
Bisphenol F epoxy resin
| Epoxy Resin Technical Specifications | Packaging Method | Application | |||||||||||||
| Model | Color | Form | Solid Content (%) |
EEW (g/eq) |
Softening Point (℃) |
Chromaticity (G/H) |
Viscosity (mPa·s) |
Hydrolyzable Chlorine (ppm) |
Bromine Content (%) |
Phosphorus Content (%) |
Sample | ||||
| Bisphenol F Epoxy Resin | Standard bisphenol F type Epoxy resin solution | EMTE160 | Colorless to Light Yellow |
Liquid | － | 155-165 | － | H≤20 | 1200-1600 | ≤150 | － | Iron drum:240kg/drum IBC package: 1000kg ISO tank package:22tons | Solvent-free coatings, castings, adhesives, insulation materials and other fields. | ||
| EMTE170 | Colorless | 165-175 | G≤1 | 3500-4500 | ≤100 |  |
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| Modified bisphenol F type Epoxy resin solution | EMTE 207K70 |
Light Yellow to Reddish Brown | 70±1.0 | 500-600 | G＜8 | ＜3000 | ＜500 | － | Galvanized iron drum packaging: 220Kg. | Printed circuit boards, electronic copper clad laminates, adhesives, composite materials, electrical laminates and other product areas. | |||||
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