| Epoxy Resin Technical Specifications | Packaging Method | Application | |||||||||||||
| Model | Color | Form | Solid Content (%) |
EEW (g/eq) |
Softening Point (℃) |
Chromaticity (G/H) |
Viscosity (mPa·s) |
Hydrolyzable Chlorine (ppm) |
Bromine Content (%) |
Phosphorus Content (%) |
Sample | ||||
| Bisphenol F Epoxy Resin | Standard bisphenol F type Epoxy resin solution | EMTE160 | Colorless to Light Yellow |
Liquid | － | 155-165 | － | H≤20 | 1200-1600 | ≤150 | － | Iron drum:240kg/drum IBC package: 1000kg ISO tank package:22tons | Solvent-free coatings, castings, adhesives, insulation materials and other fields. | ||
| EMTE170 | Colorless | 165-175 | G≤1 | 3500-4500 | ≤100 |  |
|||||||||
| Modified bisphenol F type Epoxy resin solution | EMTE 207K70 |
Light Yellow to Reddish Brown | 70±1.0 | 500-600 | G＜8 | ＜3000 | ＜500 | － | Galvanized iron drum packaging: 220Kg. | Printed circuit boards, electronic copper clad laminates, adhesives, composite materials, electrical laminates and other product areas. | |||||
