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E-mail: sales@dongfang-insulation.com
| MDI Modified Epoxy Resin Technical Specifications | Packaging Method | Application | |||||||||||||
| Model | Color | Form | Solid Content (%) |
EEW (g/eq) |
Softening Point (℃) |
Chromaticity (G/H) |
Viscosity (mPa·s) |
Hydrolyzable Chlorine (ppm) |
Bromine Content (%) |
Phosphorus Content (%) |
Sample | ||||
| MDI modified epoxy resin | Modified brominated epoxy resin | EMTE8204 | Yellowish Brown to Reddish Brown | Liquid | 74-76 | 335-365 | － | G:7-13 | 300-1000 | － | 16.5-18 | － | Iron drum:220kg/drum | Flame-retardant printed circuit board substrates, electronic copper-clad boards, capacitor packaging, electrical laminates and other product areas. | |
| － | EMTE8205 | Light Brown to Yellowish Brown | Solid | － | 280-320 | 65-75 | － | － | － | － | Paper bag with inner PE liner:25 kg/bag. | Halogen-free flame-retardant printed circuit substrates, electronic copper-clad laminates, capacitor packaging, electrical laminates and other product areas. | |||
| EMTE 8205CK75 |
Yellow Brown to Red Brown | Liquid | 74-76 | 280-320 | － | G:8-12 | 500-2500 | ≤500 | － | Iron drum:220kg/drum | |||||
