| Intermediates & Specialty Resin Technical Specifications | ||||||||||||||||
| Category | Model | Color | Form | HEW (g/eq) |
Melting Point (℃) |
Softening Point (℃) |
Chromaticity (G/H) |
Cone-Plate Viscosity (P) |
Free Phenol (ppm) |
Purity (%) |
Sample | Packaging Method | Application | |||
| Intermediates | Phenolic Resin | Bisphenol A Phenolic Resin |
EMTP322 | Colorless to Pale Yellow-Brown | Solid | － | － | 114-119 | G≤0.8 | 60-90 | ≤2000 | － |  |
Paper bag with inner PE liner:25 kg/bag. | Epoxy resin intermediates or curing agents are widely used in electronic copper clad laminates, semiconductor packaging and other fields. | |
| Base Phenolic Resin |
PF-2123 | Light Yellow to Reddish Brown | 100-105 | G:12-14 | － | ≤4 |  |
Paper bag with inner PE liner:25 kg/bag. Ton bag: 500kg/bag | Braking materials and friction materials such as brake pads for trains, cars and motorcycles, bakelite powder for electrical products, adhesives for light bulbs, resin grinding wheels and rubber wear-resistant agents for grinding and cutting, molding sand adhesives, flame retardant materials, etc. | |||||||
| ortho-Cresol Phenolic Resin |
EMTP210 | Light Yellow | 113-115 | G≤3 | 35-45 | ＜1000 | － | Paper bag with inner PE liner:25 kg/bag. | Epoxy resin intermediates or curing agents are widely used in electronic copper clad laminates, semiconductor packaging and other fields. | |||||||
| TPN Tetraphenolethane Phenolic Resin |
EMTP110 | Brown | 90-110 | 135-145 | G≤18 | － | ≤1000 | － | Epoxy resin intermediate or curing agent. | |||||||
| Bisphenol F | EMTP120 | White to Reddish Brown | － | ≥105 | － | G＜0.8 | ＜1000 | ≥88 | － | Intermediates such as low-viscosity epoxy resins, polycarbonate resins, polyphenylene ether resins and unsaturated polyesters, and can also be used to synthesize flame retardants, antioxidants and plasticizers. | ||||||
| DCPD Phenolic Resin |
EMTP100 | Reddish Brown | 150-210 | － | 100-110 | G≤13 | ≤1000 | － | － | Electronic copper clad laminate and other fields. | ||||||
| EMTD8700 Phosphazene Flame Retardant Technical Specifications | ||||||||||||||||
| Category | Model | Color | Form | Melting Point (℃) |
Volatile Content (%) |
Td5% (℃) |
Phosphorus Content (%) |
Nitrogen Content (%) |
Sample | Packaging Method | Application | |||||
| Phosphazene Flame Retardant | EMTD8700 | Earth White to Pale Yellow | Solid Powder |
104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | － | Paper bag with inner PE liner:25 kg/bag. | Copper clad laminates, electronic potting glue, functional coatings, flame retardant plastics and other industries. | |||||
| Bismaleimide Technical Specifications | ||||||||||||||||
| Category | Model | Color | Form | Melting Point (℃) |
Acid Value (mgKOH/g) |
Solubility | Sample | Packaging Method | Application | |||||||
| Bismaleimide | Electronic Grade | EMTE505 | Pale Yellow | Solid Powder |
≥155 | ≤1 | Fully Soluble | － | Film lined composite kraft paper bag or paper barrel packaging 25kg per bag/barrel. | Aerospace structural materials, carbon fiber high temperature resistant structural parts, high temperature resistant impregnation paint, laminates, copper clad laminates, molded plastics, high-grade printed circuit boards, wear-resistant materials, diamond grinding wheel adhesives, magnetic materials, castings and other functional materials and other high-tech fields. | ||||||
| Electrical Grade | D929 | Pale Yellow-White |
≥155 | ≤1 | Fully Soluble | － | ||||||||||
