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Phenolic Epoxy Resin Technical Specifications Packaging Method Application 
  Model Color Form Solid Content
(%)
EEW
(g/eq)
Softening Point
(℃)
Chromaticity
(G/H)
Viscosity
(mPa·s)
Hydrolyzable Chlorine
(ppm)
Bromine Content
(%)
Phosphorus Content
(%)
Sample
Phenolic Epoxy Resin BNE
Bisphenol A phenol formaldehyde
EMTE200 Colorless to Light Yellow Solid 200-220 62-68 G<2 ≤200   Phenolic Epoxy Resin1 Paper bag with inner PE liner:25 kg/bag. Electronic copper clad laminates, electronic laminates, heat-resistant adhesives, composite materials, high-temperature resistant coatings, civil engineering and electronic inks, etc.
EMTE200H 190-220 65-75 G≤3 ≤200
EMTE
200A80
Liquid 80±1.0 190-220 G≤2 1100-180 ≤200 Phenolic Epoxy Resin2 Iron drum:220kg/drum  
PNE
phenol novolac
epoxy resin
EMTE625 Colorless to Light Yellow Liquid 164-177 G≤1 9000-13000 ≤300 Iron drum:220kg/drum   Electronic copper clad laminates, electronic laminates, heat-resistant adhesives, composite materials, high-temperature resistant coatings, civil engineering and electronic inks, etc.
EMTE636 170-173 28-30 G≤0.8 ≤200 Phenolic Epoxy Resin3
EMTE636L 169-173 23-27 G≤1 ≤300
EMTE637 170-174 31-36 G≤0.8 ≤250
EMTE
638A80
170-180 80±1 G≤0.8 100-280 ≤200
EMTE638 171-175 36-40 G≤0.5(0.6) 35-39 80-180 Phenolic Epoxy Resin4
EMTE638S 171-175 31-35 G≤0.5 ≤200
EMTE639 174-180 44-50 G≤1 ≤300
CNE
o-Cresol aldehyde
Epoxy resin
EMTE701 Colorless to Light Yellow Solid 196-206 65-70 G<2 <500 Paper bag with inner PE liner:25 kg/bag. Electronic copper clad laminates, electronic laminates, heat-resistant adhesives, composite materials, high-temperature resistant coatings, civil engineering and electronic inks, etc.
EMTE702 197-207 70-76 G<2 <500
EMTE704 200-215 88-93 G<2 <1000
EMTE704M 200-215 87±1 G<2 40-100 Phenolic Epoxy Resin5
EMTE704ML 200-210 80-85 G<2 <1000
EMTE704L 207-215 78-83 G<2 <1000

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