Advanced Power Materials · IGBT Solutions

UPGM308 Material For IGBT Applications
For Power Applications

High-performance thermosetting composite substrate engineered for next-generation insulated gate bipolar transistor modules — enabling safer, more efficient, and more reliable power electronics worldwide.

Material Overview

What Is UPGM308 Material for IGBT Applications?

UPGM308 is a high-performance glass-fiber-reinforced thermosetting composite laminate material, widely recognized as a critical substrate and insulation component in the fabrication of Insulated Gate Bipolar Transistor (IGBT) modules for power applications. With the global acceleration of electrification — spanning electric vehicles (EVs), renewable energy infrastructure, industrial automation, and ultra-high-voltage (UHV) power transmission — UPGM308 has emerged as one of the most technically demanding and commercially strategic materials in the power electronics supply chain.

⚡ Key Definition: UPGM308 is a thermosetting epoxy glass cloth laminate engineered to deliver exceptional dielectric strength, thermal stability, mechanical rigidity, and flame retardancy — all critical parameters for IGBT packaging and power module assembly operating in harsh electrical environments.

🔬 Material Composition and Technical Properties

The UPGM308 designation refers to a specific grade within the epoxy glass cloth laminate family, manufactured using woven glass fiber reinforcement impregnated with a high-purity epoxy resin system. The cured composite exhibits a suite of properties that make it indispensable for IGBT power module applications:

Dielectric Strength: UPGM308 delivers dielectric strength values typically exceeding 20 kV/mm, ensuring robust electrical insulation between high-voltage copper conductors and heat-sink baseplate structures in IGBT modules operating at 600V–6500V blocking voltages.

Thermal Performance: With a glass transition temperature (Tg) of 130°C–150°C and continuous operating capability beyond 130°C, UPGM308 withstands the thermal cycling stress inherent in power converter duty cycles — including traction inverters and grid-tied converters where junction temperatures routinely exceed 125°C.

Mechanical Rigidity: A flexural strength exceeding 350 MPa and a high modulus of elasticity ensure dimensional stability under thermomechanical stress, preventing delamination or warpage during wire bonding, soldering, and long-term thermal cycling.

Flame Retardancy: UPGM308 achieves UL94 V-0 classification, meeting the stringent fire safety requirements for power electronics in railway traction systems, wind turbine converters, and industrial drives.

Low Moisture Absorption: The material demonstrates very low moisture uptake (<0.5%), which is critical for maintaining stable dielectric properties in humid operating environments such as marine and outdoor renewable energy installations.

Why Choose UPGM308

Outstanding Performance Characteristics

⚡

High Dielectric Strength

Exceeds 20 kV/mm, providing reliable insulation for IGBT modules up to 6500V blocking voltage applications.

🌡️

Thermal Stability

Tg of 130–150°C sustains structural integrity through intense thermal cycling in traction and industrial converters.

🔩

Mechanical Rigidity

Flexural strength >350 MPa prevents delamination and warpage under wire bonding and soldering stresses.

🔥

UL94 V-0 Rated

Halogen-containing and halogen-free grades available with highest flame retardancy for safety-critical power systems.

Market Intelligence

Commercial & Industrial Landscape for UPGM308 in Power Applications

📊 Global IGBT Market Driving Material Demand

The global IGBT market was valued at approximately USD 7.2 billion in 2023 and is projected to reach USD 14.5 billion by 2031, growing at a compound annual growth rate (CAGR) of approximately 9.1%. This robust growth is being propelled by several macroeconomic and technological trends that directly expand demand for high-quality IGBT substrate materials like UPGM308:

Electric Vehicle (EV) Proliferation: Each EV traction inverter requires between 6 and 24 IGBT modules. With global EV production forecast to exceed 40 million units annually by 2030, the downstream demand for UPGM308 substrates is enormous. Automotive-grade IGBT modules require substrate materials that comply with IATF16949:2016 quality management standards — a certification held by leading manufacturers such as Sichuan EM Technology Co., Ltd.

Renewable Energy Expansion: Wind turbines, photovoltaic inverters, and grid-scale battery energy storage systems (BESS) all utilize IGBT-based power converters at the multi-megawatt scale. Offshore wind converters operating in corrosive marine environments place particular emphasis on low moisture absorption and high dielectric reliability — characteristics squarely addressed by UPGM308.

Ultra-High Voltage (UHV) Transmission: China's State Grid and global TSOs are deploying HVDC (High Voltage Direct Current) transmission projects requiring IGBT valves at ±800 kV and beyond. The reliability requirements for insulation materials in these applications are among the most demanding in the power industry.

📈 Market Insight: Asia-Pacific — led by China, Japan, and South Korea — accounts for over 62% of global IGBT consumption, with China's domestic semiconductor power device industry investing aggressively in supply chain localization. This trend is creating strong demand for domestically manufactured UPGM308-grade laminates from established players such as Sichuan EM Technology Co., Ltd. (EMT).

🏭 Industrial Applications and End-Use Sectors

UPGM308 material for IGBT applications touches virtually every segment of the modern power economy. The following sectors represent the highest-volume and highest-growth end markets:

Sector IGBT Application UPGM308 Role Growth Driver
Electric Vehicles Traction Inverters, OBC, DC-DC Module substrate insulation EV adoption, carbon neutrality targets
Wind Power Full-power converters Baseplate insulation laminates Offshore wind expansion
Rail Traction Traction drives, auxiliary converters High-reliability insulation substrate High-speed rail network growth
Industrial Drives Variable frequency drives (VFDs) Power module packaging material Industrial automation, Industry 4.0
Smart Grid / UHV HVDC valves, STATCOM High-voltage insulation laminate Grid modernization investments
5G Infrastructure Power amplifiers, base station PSUs PCB substrate-adjacent insulation 5G rollout worldwide

By the Numbers

IGBT Power Market at a Glance

$14.5B
Global IGBT Market by 2031
9.1%
CAGR Growth Rate
62%
Asia-Pacific Market Share
6500V
Max Blocking Voltage Supported

Deep-Dive Application Analysis

UPGM308 IGBT Power Application Scenarios

🚗

EV Traction Inverters

UPGM308 substrates provide the electrical isolation between high-current copper clips and the aluminum heat sink in automotive IGBT modules rated 650V–1200V for EV powertrains.

💨

Wind Turbine Converters

In full-power 6MW–15MW offshore converters, UPGM308 endures constant thermal cycling and salt-fog conditions, maintaining dielectric integrity over 20+ year service lives.

🚄

Railway Traction Systems

High-speed rail and metro traction drives demand IGBT modules with IEC 61373 vibration compliance — UPGM308's rigid laminate structure provides the required mechanical robustness.

☀️

Solar PV Inverters

String and central inverters for utility-scale solar plants use IGBT modules where UPGM308 ensures decades of reliable insulation in high UV and temperature swing environments.

⚙️

Industrial Motor Drives

VFDs for pumps, fans, and compressors in chemical, oil & gas, and manufacturing sectors rely on UPGM308-based IGBT modules for continuous 24/7 duty cycle reliability.

🔋

Battery Energy Storage

Grid-scale BESS converters operating in bidirectional charge/discharge cycles require IGBT modules with ultra-reliable insulation to ensure long calendar life and low O&M costs.

🔌

UHV HVDC Transmission

±800 kV HVDC valve stacks use thousands of IGBT modules in series, where UPGM308 insulation must sustain extraordinary partial discharge resistance and long-term stability.

📡

5G & Data Center Power

Uninterruptible power supplies (UPS) and telecom rectifiers in 5G base stations and hyperscale data centers leverage IGBT efficiency gains enabled by UPGM308 substrates.

Future Outlook

Development Trends for UPGM308 in Power Electronics

🚀 Toward Silicon Carbide (SiC) Co-Existence

While SiC MOSFETs are increasingly displacing IGBTs in certain sub-1200V EV applications, IGBT technology retains dominance in medium-voltage (1700V–6500V) industrial and traction segments, where cost-per-ampere competitiveness and proven long-term reliability remain decisive. Accordingly, demand for UPGM308 substrates is forecast to remain robust through 2035 and beyond.

Furthermore, hybrid modules combining SiC diodes with IGBT switches — a growing architectural trend — still require UPGM308-grade insulation laminates, meaning that the material's relevance is not diminished by the SiC transition but evolves alongside it.

🌿 Halogen-Free and Eco-Friendly Formulations

Regulatory pressure from REACH, RoHS, and China's GB standards is driving laminate manufacturers to develop halogen-free UPGM308 variants that maintain V-0 flammability ratings using phosphorus-based or nitrogen-based flame retardants. EMT's expertise in phosphorus-containing epoxy resin systems positions the company at the forefront of this transition, enabling UPGM308 laminates that satisfy both environmental mandates and the demanding performance criteria of power module assembly.

🏗️ Localization and Supply Chain Security

Geopolitical disruptions and supply chain vulnerabilities exposed during the 2020–2022 period have accelerated "China-for-China" procurement strategies among domestic IGBT module manufacturers such as BYD, CRRC, and NARI. This trend strongly favors domestic suppliers of certified UPGM308 materials — particularly those with ISO9001, IATF16949:2016, and ISO14001 certification — as OEMs seek to reduce dependence on imported laminate substrates.

🔧 Advanced Processing Compatibility

Modern IGBT module assembly techniques — including direct copper bonding (DCB), active metal brazing (AMB), and sintered silver die-attach — are placing new demands on substrate materials. Next-generation UPGM308 formulations are being developed with improved surface planarity, tighter thickness tolerances, and enhanced adhesion properties to support these advanced packaging processes, enabling higher power density modules with superior thermal performance.

Our Philosophy

Vision & Mission

Vision

To Become a World-renowned Innovative New Material Product and Service Supplier.

Mission

To Provide Safe and Environment-friendly New Material Solution for the Society, Create a Better New Life.

About the Manufacturer

— COMPANY PROFILE

Sichuan EM Technology Co., Ltd., established in 1966 and headquartered in Mianyang, Sichuan, south-west part of China, as the 1st public company of electrical insulation material manufacturer in China and National Insulation Material Engineering Technical Research Center, we have comprehensive R&D and manufacturing capabilities to manufacture polyester films, halogen-free polycarbonate and polypropylene films, capacitor polypropylene films, rigid & flexible laminates, mica tapes, thermosetting composites, precision coating product, molding compounds (DMC, SMC), functional PET chips (FR PET chip, anti-bacterial PET chip, etc.), impregnating varnishes and wire enamels, PVB resin & interlayers, special resin (esp. for CCL), etc. We are certified by ISO9001, IATF16949:2016, ISO10012, OHSAS18001 and ISO14001.

We export to the worldwide markets in varied industries, including power generation equipment, UHV power transmission, smart grid, new energy, rail transportation, consumer electronics, 5G communication, and panel display. EMT has established long-term and stable cooperative partnerships with all our partners across the world, whilst providing strong supports in manufacturing services to original equipment manufacturers (OEMs).

Insulation Material - Sichuan EM Technology
EMT Manufacturing Sites Map

Manufacturing Sites

  • Mianyang Site
  • Chengdu Site
  • Sichuan EMT New Material
  • Central China Site
  • Eastern China Site
  • Shandong Dongrun New Material
  • Shandong EMT New Material
  • SNTON Optical Material
Mianyang Manufacturing Site

Our Journey

Milestone

2024

Meishan base established. Chengdu second headquarters officially completed.

2023

Shandong Aimonte awarded "Little Giant with Specialization" in Shandong Province. Aimonte Aviation awarded National Second-Class Confidentiality Qualification. Henan Huajia awarded "Gazelle" Enterprise in Henan Province.

2022

Established Chengdu Glenson Health Technology Co., Ltd., and Sichuan EM Technology (Chengdu) International Trading Co., Ltd.

2021

Established Sichuan EM Functional Film Materials & Technology Co. Ltd., and Sichuan EMT New Material Co., Ltd.

2020

Wholly-owned acquired Shandong Shengtong Optical Materials Technology Co., Ltd., and established Shandong EMT New Material Co., Ltd.

2018

Established EMT Chengdu New Material Co., Ltd., and Chengdu Drug and Cancer Pharmaceutical Technology Co., Ltd.

2015

Acquired 51% of total equity of Taihu Jinzhang Science & Technology Co., Ltd.

2014

Acquired 62.5% of total equity of Henan Huajia New Material Technology Co., Ltd.

2012

Established Jiangsu EMT New Material Co., Ltd.

2011

Listed on the Shanghai A-share market, the first electrical insulation materials industry listed company in China.

2007

Renamed Sichuan EM Technology Co., Ltd.

2005

Wholly-owned acquisition by Guangzhou Gaoking Group.

1994

Restructured into Sichuan Dongfang Insulation Materials Co., Ltd., and established Sichuan EM Enterprise Group Company.

1966

EMT's predecessor, state-owned Dongfang Insulation Material Factory relocated from Harbin to Sichuan.

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