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Global Supplier of Environmental Protection

And Safety New Material Solutions

Specific Electronic Resin

In the field of electronic resins, we’re committed to providing high-performance resin and endeavor to offer whole solutions for the field of CCL. Aimed to realize localization of electronic resin for display and IC, we built 110,000 tons of special epoxy resin workshop, supplying benzene and oxazine resin, electronic series of epoxy resin, phenolic resin, series of hydrocarbon resin, and active ester curing agent, special monomer and maleic imide resin series.


Applications Images

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Benzoxazines Resin
Low-DK Benzoxazine Resin series
Bisphenol A epoxy resin series
Bisphenol F epoxy resin series
Phenolic epoxy resin series
Phosphorus containing epoxy resin series
Brominated epoxy resin series
MDI modified epoxy resin series
Macromolecular epoxy resin series
DCPD epoxy resin series
Multifunctional epoxy resin series
Crystalline/liquid crystal epoxy resin series
Phenol Formaldehyde Resin series
Phosphorus containing phenolic resin series
Modified hydrocarbon resin series
Hydrocarbon resin composition series
Active Ester
Special Resin Monomer
Maleimide Resin series
Benzoxazines Resin

Our company is the first company to realize the mass industrial production of Benzoxazine Resin in China, and is in the leading position in the production, application and research fields of Benzoxazine Resin. Benzoxazine Resin products of our company have passed SGS detection, and they do not contain halogen and RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) harmful substances. The characteristic is that there is no small molecule released during the curing process and the volume is almost zero shrinkage; The curing products have the characteristics of low water absorption, low surface energy, good UV resistance, excellent heat resistance, high residual carbon, no need of strong acid catalysis and open-loop curing.lt is widely used in electronic copper clad laminates, laminates, composite materials, aerospace materials, friction materials and other fields.

Name

Grade No

Appearance

 softening

point

(°C)

Free

Phenol

(%)

GT (s @210℃)

Viscosity

 N.V.

(%)

properties

MDA type Benzoxazine

DFE125

Brownish red transparent liquid

-

≤ 5

100-230

30-70 (s,4# 杯)

70±3

High Tg, high heat resistance, halogen-free flame retardant, high strength and toughness

BPA type Benzoxazine

DFE127

Yellow transparent liquid

-

≤ 5

1100-1600

200-800

Mpa·s

80 土 2

High modulus, high heat resistance, halogen-free flame retardant, low water absorption

BPA type Benzoxazine

DFE127A

Yellow solid

60-85

≤ 5

500-800

-

98±1,5

High modulus, high heat resistance, halogen-free flame retardant, low water absorption

BPF type Benzoxazine

DFE128

Brownish red transparent liquid

-

≤ 5

350-400

30-100

(s,4# 杯)

75±2

Good toughness, high heat resistance, halogen-free flame retardant, low water absorption and low viscosity

ODA type Benzoxazine

DFE129

Brownish red transparent

-

≤ 2

120-500

<2000

mpa.s

65 土 3

Tg: 212°C, Free PlienoK≤ 2%,

Dk: 2.92, Df 0.0051

Low-DK Benzoxazine Resin series

Low dielectric Benzoxazine Resin is a kind of Benzoxazine Resin developed for high frequency and high speed copper clad laminate. This kind of resin has the characteristics of low Dk / DF and high heat resistance. It is widely used in M2, M4 grade copper clad laminate or HDI board, multilayer board, composite materials, friction materials, aerospace materials and other fields.

Name

Grade No

Appearance

softening

point

rc>

Free

Phenol

(%)

GT (s @210℃)

Viscosity

N.V. (%)

properties

Low dielectric benzoxazine

DFE130

 Yellow granular or massive solid

55-80

≤ 5

400-600

≥98.5

Dk: 2.75、Tg:196℃:

 Rapid curing of benzoxazine at medium and low temperature

DFE146

 Brownish yellow transparent liquid

-

≤ 5

100-130

<200 (s,4# 杯)

75±2

Dk: 3.04, Df: 0.0039 High curing speed, high Tg and low dielectric

Benzoxazine with double bond

DFE148

 Brownish red transparent liquid

-

≤ 5

 Actual

measurement

<2000

Mpa·s

80±2

It can react with other resins containing double bond

Main chain benzoxazine

DFE149

 Brownish yellow transparent liquid

-

≤ 3

80-160

<2000

Mpa·s

70 土 2

Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df 0.0074 (10GHz)

DCPD type Benzoxazine

DFE150

Reddish brown transparent liquid

-

≤ 3

2000-2500

<1000

Mpa·s

75±2

Dk: 2.85, Df: 0.0073 (10GHz)

Bisphenol benzoxazine

DFE153

Brownish yellow transparent liquid

≤ 3

100-200

<2000

Mpa·s

70±2

Dk: 2.88, Df: 0.0076 (10GHz) ,

Bisphenol A epoxy resin series

Bisphenol A epoxy resin of our company includes liquid epoxy resin, solid epoxy resin and solvent epoxy resin, which has low hydrolysis chlorine and is widely used in coatings, electronic materials, composite materials and other fields.

Name

Grade No

EEW (g/eq)

 Color

(G)

 Viscosity

(mPa.s)

 Hy-Cl

(ppm)

Liquid bisphenol A epoxy resin

DFE1126

165-175

≤0.5

3000-5000

<200

DFE1127

180-190

≤1

8000-11000

<500

DFE1128

184-194

≤1

12000-15000

<500

DFE1128H

184-194

≤1

12000-15000

<100

Name

Grade No

EEW(g/eq)

 Color

(G)

 Softening point(℃)

Solid bisphenol A epoxy resin

DFE1011

450-500

≤1

60-70

DFE1901

450-500

≤1

65-75

Name

Grade No

EEW (g/eq)

 Color

(G)

 Viscosity

(mPa.s)

 N.V.

(%)

Solution type liquid bisphenol A epoxy resin

DFE1901EK70

450-500

≤1

2000-5000

70±1

Bisphenol F epoxy resin series

 Bisphenol F epoxy resin has the characteristics of low viscosity, good fluidity and wettability, and our company has independent bisphenol F production technology with sufficient raw materials. Products are widely used in solvent-free coatings, casting, adhesives, insulation materials and other fields.

Name

 Grade No

EEW (g/eq)

 Viscosity

(mPa·s)

 Color

(G)

Hy-Cl

(ppm)

Liquid bisphenol F epoxy resin

DFE1160

155-165

≤1600

≤1

≤100

DFE1170L

165-175

2900-3500

≤1

≤100

DFE1170

165-175

3500-4500

≤1

≤100

DFE1170H

165-175

5000-6000

≤1

≤100

DFE1170K

165-175

5000-6000

≤1

≤200

Name

 Grade No

EEW (g/eq)

 Color

(G)

 Softening point(℃)

Solid bisphenol F epoxy resin

DFE1701

450-500

≤1

45-55

DFE1702

600-700

≤1

75-85

DFE1703

700-800

≤1

85-95

DFE1704D

900-1000

≤1

90-100

DFE1707D

1300-1700

≤1

100-110

Phenolic epoxy resin series

Our phenolic epoxy resins include PNE type, BNE type and CNE type. Their cured products have high crosslinking density, excellent bonding strength, heat resistance and chemical resistance. They are widely used in electronic copper clad laminates, electronic laminates, heat-resistant adhesives, composites, high-temperature coatings, civil engineering and electronic inks.

Name

 Grade No

EEW (g/eq)

softening point

(°C)

 Color

(G)

 Hy-Cl

(ppm)

PNE type phenolic epoxy resin

DFE1638

171-180

36-40

≤0.5

≤200

DFE1638S

171-179

36-40

≤0.5

≤200

DFE1636

170-178

27-31

<1

<300

DFE1637

170-178

31-36

<1

<300

DFE1639

174-180

44-50

<1

<300

DFE1625

168-178

9000-13000mpa·s

≤1

<300

BNE type phenolic epoxy resin

DFE1200

200-220

60-70

<3

<500

DFE1200H

205-225

70-80

<3

<500

DFE1200HH

210-230

80-90

<3

<500

CNE type phenolic epoxy resin

DFE1701

196-206

65-70

<2

<500

DFE1702

197-207

70-76

<2

<500

DFE1704

200-215

88-93

<2

<1000

DFE1704M

200-215

83-88

<2

<1000

DFE1704ML

200-210

80-85

<2

<1000

DFE1704L

207-215

78-83

<2

<1000

Name

Grade No

EEW (g/eq)

 Viscosity

(mPa.s)

 N.V.

(%)

Solution type phenolic epoxy resin

DFE236

200-220

1000-4000

80±1

DFE238

170-190

200-500

80 土 1

Phosphorus containing epoxy resin series

Phosphorus-containing epoxy resins mainly include three types,namely DOPO type, DOPO-HQtype and DOPO-NQtype. They are excellent in flame retardancy and heat resistance, and have low water absorption and expansion coefficient.They belong to halogen-free flame retardant epoxy resin,and conform to RoHS and WEEE Directive.They are mainly applied in halogen-free flame retardant printed circuit board, electronic copper clad laminate,electrical laminate and other product fields.

Name

 Grade No

 Appearance

 N.V.

(%)

EEW (g/eq)

 Viscosity

(mPa.s)

 P%

(%)

DOPO-HQ modified phenolic epoxy resin

DFE200

Reddish brown transparent liquid

70±1.0

320 ±20

<1000

2.0±0.1

DOPO-HQ modified phenolic epoxy resin

DFE200A

Reddish brown transparent liquid

70±1.0

275 ±25

<1000

1.0±0.1

DOPO-HQ modified phenolic epoxy resin

DFE200C

Yellow transparent liquid

80±1.0

255 ±15

1000-7000

2.0±0.1

 DOPO-HQ modified phenolic epoxy resin

DFE200D

Yellow transparent liquid

80±1.0

230±20

1000-4000

1.0±0.1

DOPO-NQ modified phenolic epoxy resin

DFE201

Reddish brown transparent liquid

75±1.0

330±30

1000-3000

2.5 ±0.1

DOPO-NQ modified phenolic epoxy resin

DFE201A

Reddish brown transparent liquid

75±1.0

330 土 10

1500-1700

2.5 ±0.1

DOPO modified phenolic epoxy resin

DFE202

Colorless to light yellow transparent liquid

75 ±1.0

315±20

1000-3000

3.1 〜3.2

DOPO modified phenolic epoxy resin

DFE202A

Reddish brown transparent liquid

70 ±1.0

300±20

<2000

2.4±0.1

DOPO modified phenolic epoxy resin

DFE202B

Colorless to light yellow transparent liquid

75±1.0

310±20

≤3000

2.8 〜3.2

DOPO modified phenolic epoxy resin

DFE202C

Clean and transparent liquid

75±1.0

300±20

<3000

3.1 ±0.1

DOPO modified phenolic epoxy resin

DFE202D

Light yellow transparent liquid

70±1.0

360 土 30

≤ 1500

2.5 ±0.2

Brominated epoxy resin series

Brominated epoxy resins are a kind of halogen flame retardant epoxy resins. Our company produces high bromine content and low bromine content epoxy resin, which have good permeability to glass cloth, excellent flame retardant and heat resistance, and are widely used in the field of non halogen flame retardant copper clad laminate.

Name

 Grade No

Appearance

 N.V.

(%)

EEW (g/eq)

 Viscosity

(mPa.s)

Br%

(%)

 low bromine content epoxy resin

DFE271

Yellowish brown to reddish brown transparent liquid

80±1.0

250-280

200-800

11.5±1.0

DFE274

Yellowish brown to reddish brown transparent liquid

75±1.0

280-320

200-1500

18-21

DFE276

Yellowish brown to reddish brown transparent liquid

75 土 1.0

340-380

200-400

18-21

DFE277

Yellowish brown to reddish brown transparent liquid

80±1.0

410-440

800-1800

18-21

DFE278

Reddish brown transparent liquid

80±1.0

410-440

800-1800

18-21

Name

Grade No

 Appearance

EEW (g/eq)

 softening

point

(°C)

 Br%

(%)

 high bromine content epoxy resin

DFE270

Colorless to yellowish solid

380-420

67-74

46-50

MDI modified epoxy resin series

The MDI modified epoxy resin is a Isocyanate modified epoxy with oxazolidinone embedded in the main chain, which has excellent heat resistance and flexibility. The product is available in Boron free and Boron containing, It is soluble in common solvents such as propylene glycol methyl ether, acetone, butanone, etc. .It has good compatibility with dicyandiamide, phenolic curing agent, and it is suitable for halogen-free lead-free copper clad laminate field.

Name

 Grade No

 Appearance

 N.V.

(%)

EEW (g/eq)

 Viscosity

(mPa.s)

 Br%

(%)

MDI modified brominated epoxy resin

DFE204

Reddish brown transparent liquid

75±1.0

330-370

500-2000

16.5-18

DFE204A

Reddish brown transparent liquid

75±1.0

330-370

500-2000

16.5-18

 MDI modified epoxy resin

DFE205

Yellowish brown transparent liquid

75 ±1.0

250-310

500-2500

-

DFE205A

Yellowish brown transparent liquid

75 ±1.0

270-330

500-2500

-

Macromolecular epoxy resin series

Macromolecular epoxy resins are a kind of modified bisphenol A/F epoxy resins, which contain flexible molecular skeletons and long molecular chain segments, and have excellent flexibility and adhesion.They are commonly used in epoxy resin systems to increase flexibility and adhesion, and improve resin flowability. They are suitable for printed circuit board, electronic copper clad laminate, adhesive, composite materials, electrical laminate and other products.

Name

 Grade No

 Appearance

N.V.

(%)

EEW

(g/eq)

 Viscosity

(mPa.s)

Modified bisphenol A epoxy resin

DFE206

Colorless to light yellow transparent liquid

75 土 1.0

470±30

500-3000

Modified bisphenol Fepoxy resin

DFE207

Light yellow to reddish brown transparent liquid

70±1.0

550 ±50

500-3000

DCPD epoxy resin series

4ac4c48f1

DCPD epoxy resin is a kind of linear multifunctional epoxy resin with low Dk / DF, excellent heat resistance, low humidity, high adhesion and chemical resistance. It is widely used in high frequency and high speed copper clad laminate, molding materials, flame retardant coatings, flame retardant adhesives and other fields.

Name

 Grade No

EEW (g/eq)

softening point

(°C)

 Hy-Cl

(ppm)

Solid DCPD epoxy resin

DFE211LL

260-275

53-60

<300

DFE211L

265-275

60-70

<300

DFE211

260-280

70-80

<300

DFE211H

260-280

80-90

<300

DFE211HH

265-285

90-100

<300

Name

 Grade No

EEW (g/eq)

 N.V.

(%)

 Viscosity

(mPa.s)

DCPD epoxy resin solution

DFE210

260-280

75±1

200-800

Multifunctional epoxy resin series

Multifunctional epoxy resin is a kind of epoxy resin with three or four functional degrees. It has the characteristics of high cross-linking density, good heat resistance, fast curing, high strength and excellent chemical resistance. It is widely used in the fields of electronic copper clad laminate and composite materials.

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DFE250

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DFE254

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DFE256

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DFE258

Name

Grade No

EEW (g/eq)

Color

(G)

Hy-Cl

(ppm)

Tetrafiinctional epoxy resin

DFE250

195-230

≤18

-

High temperature resistant multifunctional epoxy resin

DFE254

110-120

<11

<1000

DFE256

90-110

<11

<1000

Trifunctional epoxy resin

DFE258

155-175

<18

<1000

Name

Grade No

EEW (g/eq)

N.V.

(%)

Viscosity

(mPa.s)

Tetrafunctional epoxy resin solution

DFE251

200-240

70 士 1

50-250

Crystalline/liquid crystal epoxy resin series

Crystalline (liquid crystal) epoxy resin has the characteristics of low viscosity, heat resistance, high fluidity, low coefficient of linear expansion and low water absorption, which is widely used in electronic copper clad laminate, composite materials and other fields.

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DFE260

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DFE261

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DFE262

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DFE264

Name

Grade No

EEW (g/eq)

melting /softening point

(°C)

Hy-Cl

(ppm)

properties

Biphenyl phenolic epoxy resin

DFE260

280-300

65-75

<300

Low dielectric, high heat resistance

Biphenyl Liquid Crystalline Epoxy resin

DFE261

184-192

>100

<300

Low viscosity, high thermal conductivity

BHQBiphenyl Crystalline Epoxy resin

DFE262

168-180

>136

<300

Low viscosity, flame retardant

Tetramethylbisphenol F epoxy resin

DFE264

190-210

>69

<300

Low viscosity, low dielectric

Phenol Formaldehyde Resin series

Linear phenolic resin is a fine and high-purity phenolic resin developed for electronic materials industry. It is characterized by light color, narrow molecular weight distribution and low free phenol content (the lowest can be reduced to l00ppm). It is widely used in electronic copper clad laminate, semiconductor packaging and other fields. In addition, while providing customers with specific softening point products, our company can also provide resin butanone solution with solid content of 60% - 70% according to the demand.

Name

Grade No

 Appearance

 softening

point

(°C)

Free Phenol (%)

Non Volatile Content

(%)

 hydroxyl equivalent (g/eq)

 Phenol Formaldehyde Resin

DFE308

Colorless to light yellow transparent solid

84 土 3

<0.05

≥ 99.5

106±2

DFE309

95±3

<0.05

≥ 99.5

106±2

DFE310

DFE311

98±3

≤0.1

≥ 99.5

106±3

105 ±3

≤0.1

≥99.5

106±3

DFE312

115±3

≤0.1

≥99.5

106±3

 BP A type phenolic resin

DFE322

Yellowish to brownish red solid

122 ±3

≤0.1

≥99.5

118±3

Phosphorus containing phenolic resin series

Phosphorus containing phenolic resin has high phosphorus content and good flame retardancy, which can make up for the deficiency of low phosphorus content in phosphorus containing epoxy resin. It is suitable for electronic copper clad laminate, capacitor packaging, electrical laminate and other fields.

Name

 Grade No

 Appearance

 N.V.

(%)

P%

(%)

 Viscosity

(cps)

hydroxyl equivalent (g/eq)

properties

Phosphorus contaming phenolic resin

DFE392

Yellow transparent liquid

60 ±1.0

8.9 〜9.2

400—3000

360〜400

 Good flame retardancy

DFE394

Yellow transparent liquid

60 ±1.0

8.9 〜9.2

3000〜5000

320〜360

High activity and flame retardancy

DFE395

Yellow transparent liquid

56±1,0

8.9 〜9.2

1000〜4000

320〜360

High activity and flame retardancy

D992-2

 Yellow to brown transparent

60 ±1,0

8,6 〜8.8

400—3000

320〜360

 Low cost, good flame retardant

D994

Yellow transparent liquid

60 ±1,0

8.9 〜9.2

400〜3000

320〜360

High activity and flame retardancy

Modified hydrocarbon resin series

Hydrocarbon resin series is an important kind of high frequency circuit substrate resin in 5g field. Because of its special chemical structure, it generally has low dielectric, excellent heat resistance and chemical stability. It is mainly used in 5g copper clad laminates, laminates, flame retardant materials, high temperature resistant insulating paint, adhesives and casting materials. The products include modified hydrocarbon resin and hydrocarbon resin composition.

Modified hydrocarbon resin is a kind of hydrocarbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.

Name

 Grade

No

 Appearance

 N.V.

(%)

 Viscosity

(mPa.s)

properties

Modified styrene butadiene resin

DFE401

Light yellow liquid

35±2.0

<3000

 High molecular weight and low dielectric. Mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Epoxy resin modified styrene butadiene resin

DFE402

Colorless to yellowish liquid

60±2.0

<5000

 Anhydride modified epoxy with low dielectric properties is

mainly used in high-speed materials

Styrene butadiene resin with low dielectric properties

DFE403

60±2.0

<2000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Modified hydrocarbon resin

DFE404

40+2.0

<2000

 Low dielectric, low water absorption, high peel strength

Modified polystyrene resin

DFE405

60 土 2.0

<3000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Modified hydrocarbon resin

DFE406

35±2.0

<2000

Low water absorption, high peel strength, better dielectric

properties

hydrocarbon resin

DFE412

Light yellow liquid

50 土 2.0

<8000

 High modulus, high molecular weight and low dielectric

Double bond resin with low dielectric properties

DFE416

 Colorless to yellowish liquid

60+2.0

<2000

 High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system

Hydrocarbon resin composition series

Hydrocarbon resin composite is a kind of hydrocarbon resin composite developed by our company for 5g communication. After dipping, drying, laminating and pressing, the composite has excellent dielectric properties, high peel strength, good heat resistance and good flame retardancy. It is widely used in 5g base station, antenna, power amplifier, radar and other high- frequency materials.carbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.

Name

 Grade No

 Appearance

 N.V.

(%)

properties

Hydrocarbon resin composition

DFE407

White to yellowish liquid

65 ±2.0

Dk/Df: 3.48/0.0037   Mainly used in power amplifier (V0)

DFE407A

65 ±2.0

Dk: 3.52

High fluidity, mainly used in the production of adhesive

sheet

DFE408

65 ±2.0

Dk/Df: 3.00/0.0027

Mainly used in base station and antenna (multilayer board, flame retardant V0)

DFE408A

65 ±2.0

Dk: 3.00

High fluidity, mainly used in the production of adhesive

sheet

DFE409

65 ±2.0

Dk/Df: 3.30/0.0027

Mainly used in antenna (double-sided board, non flame retardant V0)

DFE410

65 ±2.0

Dk/Df: 3.40/0.0029

Mainly used in antenna (double-sided board, non flame retardant V0)

DFE411

65 土 2.0

Dk/Df: 3.38/0.0027

Mainly used in power amplifier (non flame retardant)

Active Ester

he active ester curing agent reacts with epoxy resin to form a grid without secondary alcohol hydroxyl group. The curing system has the characteristics of low water absorption and low Dk / Df.

Name

Grade No

appearance

Ester equivalent

N.V.

(%)

Viscosity (卬s)

softening point

rc)

Low dielectric active ester curing agent

DFE607

Light brown viscous liquid

230〜240

69 ±1.0

1400〜1800

140〜150

DFE608

Brownish red liquid

275-290

69±1.0 Available solids

800-1200

140-150

DFE609

Brown liquid

275-290

130-140

DFE610

Brown liquid

275-290

100-110

Special Resin Monomer

The content of phosphorus is more than 13%, the content of nitrogen is more than 6%, and the hydrolysis resistance is excellent. It is suitable for electronic copper clad laminate, capacitor packaging and other fields.

BIS-DOPO ethane is a kind of phosphate organic compounds, halogen-free environmental flame retardant. The product is white powder solid. The product has very good thermal stability and chemical stability, and the thermal decomposition temperature is above 400 °C. This product is highly efficient flame retardant and environmentally friendly. It can fully meet the environmental requirements of the European Union. It can ~be used as a flame retardant in the field of copper clad laminate. In addition, the product has excellent compatibility with polyester and nylon, so it has excellent spinnability in the spinning process, good continuous spinning and coloring properties, and is also widely used in the field of polyester and nylon.

Name

Grade

No

Appearance

melting

point

(℃)

P%

%

N%

(%)

Td5%(℃)

Properties

Phosphazene flame retardant

DFE790

Earthy white or yellow powder

108 ±4.0

≥13

≥6

≥320

High phosphoms content, flame retardant, high heat resistance, hydrolysis resistance, suitable for copper clad laminate and other fields

Name

Grade

No

Appearance

content

%

melting

point

CC)

P%

%

Td2%

V

Properties

BIS-DOPO ethane

DFE791

White powder

≥99

290-295

≥13

≥400

Chloride ion content < 20ppm, high melting point, high cracking tenperature, low e^ansion coefficient

Maleimide Resin series

DFE930n DFE936> DFE937, DFE939^ DFE950 and DFE952 are all electronic grade maleimide resins with high purity, less impurities and good solubility. Due to the imine ring structure in the molecule, they have strong rigidity and excellent heat resistance. They are widely used in aerospace structural materials,carbon fiber high temperature resistant structural parts,high temperature resistant impregnating paint, laminates, copper clad laminates, molded plastics, etc High grade printed circuit "board, wear-resistant materials, diamond wheel adhesive, magnetic materials, casting parts and other iunctional materials and other high-tech fields.

Name

Grade NO

Appearance

Melting

point

(℃)

Acid Value ( mg KOH/g)

Volatile

content

(%)

(5mm) Solubility of hot toluene (5min)

Properties

Electrical grade Bismaleimide

DFE928

Yellow solid particles

158±2

≤3.0

≤0.3

Fully soluble

 High heat resistance

Electronic grade diphenylmethane Bismaleimide

DFE929

Light yellow solid particles

162 ±2

≤1.0

≤0.3

 High purity and low acid value

Electronic grade Bismaleimide

DFE930

Light yellow white powder

160 ±2

≤1.0

≤0.3

High purity aad low acid^lue

Low crystalline Bismaleimide

DFE936

168 ±2

≤1.0

≤0.3

Good solubility

 Low crystalline and low dielectric Bismaleimide

DFE937

168 ±2

≤1.0

≤0.3

Good solubility

Phenyl bismaleimide with low melting point

DFE939

 Light brown solid or yellow solid powder

50 土 10

≤3.0

≤0.3

Good solubility

Low melting point polymaleimide

DFE950

50 ±10

≤3.0

≤0.3

Good solubility

Low meltmg point tetramaleirnide

DFE952

50 ±10

≤3.0

≤0.3

Good solubility

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